Chinese OEM Xiaomi is expected to launch its flagship Mi 10 series at an online-only event on February 13th. At the event, the company will be showcasing the Mi 10 and Mi 10 Pro, powered by Qualcomm’s latest Snapdragon 865 SoC and up to 12GB of LPDDR5 RAM from either Micron or Samsung. We already have reason to believe that both the devices will also include Samsung’s 108MP ISOCELL Bright HMX sensor and that the higher-end Pro variant will support 66-watt fast wired charging. Now, Xiaomi has released a teaser poster for the launch event on Weibo confirming some of these details.
The latest teaser poster was shared by Xiaomi’s co-founder Lei Jun on his official Weibo page and it showcases the Mi 10 in all its glory. The poster confirms that the Xiaomi Mi 10 will indeed feature a 108MP primary sensor, along with three more camera modules on the back. Additionally, the poster also reveals that the device will feature a curved display, much like the one we expect to see on Samsung’s upcoming flagship S20 series. In a separate post, Jun also revealed that the Mi 10 duo will include support for UFS 3.0 storage. This will help the device achieve the fastest sequential write speeds of up to 730MB/s which is expected to help the device process the 108MP photos much faster than the Mi Note 10 from late last year.
But that’s not all, Jun has also revealed some key details about the cooling system on the Xiaomi Mi 10 in yet another post. The post highlights information shared by Xiaomi’s thermal design experts who have revealed that the Mi 10 will feature the largest (by area) VC heat-dissipating board in any smartphone. The heat-dissipating board is almost three times the area of the VC on the Mate 30 Pro 5G and it’s expected to greatly improve the Mi 10’s thermal performance. To improve the system’s efficiency even further, Xiaomi has made use of a Graphene heat dissipation material to move heat away from the core components of the flagships. The device will also include a total of 6 layers of graphite sheets covering almost the entire body, along with an independent graphite cooling solution for the camera and the flash. Rounding it all off is a large copper foil and thermally conductive gel that covers every single component inside the machine for optimal cooling.
Xiaomi’s Wan Teng Thomas has revealed even more details about the heat-dissipation design on the Mi Note 10, but from a software standpoint. In a post on the Chinese social media platform, Thomas reveals that along with the aforementioned heat-dissipation hardware, the Mi 10 will make use of software to analyze the temperature control point data and dynamically adjust the power consumption. This could, in effect, help the Xiaomi Mi 10 achieve unparalleled thermal performance.
What’s your take on the Xiaomi Mi 10 and Mi 10 Pro? Do you think Xiaomi’s value flagships will have what it takes to compete with flagships from more premium brands?
The post Xiaomi’s Mi 10 teaser posters confirm 108MP quad cameras and curved display appeared first on xda-developers.
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